Market and Growth Forecast for Advanced Packaging Technologies
In the evolutionary journey of the semiconductor industry, advanced packaging technologies have become a key driver for technological innovation and market growth. As traditional transistor scaling approaches its physical limits, the industry is turning to advanced packaging to achieve higher performance, lower power consumption, and more compact system designs. Yole's report, "Status of the Advanced Packaging 2023," provides an in-depth analysis of this transformative field, covering market dynamics, technology trends, supply chain challenges, and the impact of geopolitical factors on the global semiconductor industry.
The advanced packaging industry has experienced significant development since 2018, reaching new heights with continuous technological advancements and growing market demand. During this process, the industry has witnessed a shift from traditional packaging technologies to more advanced ones, including the development of innovative technologies such as 2.5D, 3D, System-in-Package (SiP), and Hybrid Bonding.
In 2022, the value of the advanced packaging market reached $44.3 billion, with an expected growth to over $78.6 billion by 2028, demonstrating a Compound Annual Growth Rate (CAGR) of 10% from 2022 to 2028. This growth is driven by key markets such as mobile and consumer electronics, automotive, and telecommunications infrastructure.
Technology trends indicate that advanced packaging technologies such as Flip-Chip, 2.5D/3D, and System-in-Package (SiP) will continue to dominate the market, with an expected market share of over 90% by 2028.
Regarding the impact of geopolitics on the supply chain, the current tense situation, especially the technological competition between the US and China, is leading to the restructuring of supply chains, prompting countries to seek strengthening of domestic supply chains and reducing reliance on external suppliers.
