Home > News > TI: Increased inquiries, price hikes for select models; MOLEX: U.S.-made products up over 10%

TI: Increased inquiries, price hikes for select models; MOLEX: U.S.-made products up over 10%

Original Manufacturer Market Updates 

MOLEX: U.S.-made products see over 10% price increase

  • [Pricing]According to distributor feedback, amid U.S.-made tariff developments, select channels have raised prices for U.S.-made components by over 10% this week. Additionally, some U.S.-made items are being sold at double the market price, such as high-unit-cost terminals like 330013006 and 330012004. Customers requiring immediate stock should prioritize these items.

AMPHENOL: Gold-Plated Series Price Increase

  • [Pricing]Per manufacturer notification, AMPHENOL's gold-plated series will increase in price in November. Specific percentage increases will be announced next week upon release of the official price adjustment notice.

TI: Increased Inquiries, Price Hikes on Select Models

  • [Pricing]On October 10, 2025 (U.S. local time), President Trump announced plans to impose new 100% tariffs on Chinese imports starting November 1, 2025, or sooner." Currently, specific TI part numbers are experiencing price increases in the market, while customer inquiries for these products have also surged.
  • [Demand]The industrial market demonstrates relatively stable performance, warranting closer attention to demand for products related to industrial automation. Meanwhile, the automotive electronics market faces a noticeable delay in recovery due to macroeconomic conditions and inventory issues. However, potential opportunities exist for demand in power chips related to electrification and intelligentization, as well as high-computing-power intelligent driving SoCs (System-on-Chip).
  • [Hot Components]
    • TMS320F28335PGFA: A 32-bit high-performance digital signal controller within the C2000™ series, suitable for demanding real-time control applications. It can be used in motor drives, servo systems, solar inverters, and automotive electronics applications such as electric powertrains and onboard chargers.
    •  SN65HVD3082EDR: TI's low-power, half-duplex RS-485 transceiver chip is designed specifically for industrial communication scenarios. Features low power consumption, high noise immunity, and multi-node support, making it suitable for PLCs, sensor networks, chassis interconnects, rack status signal transmission, and data monitoring in high-temperature environments.

NXP: Stable Demand for General-Purpose MCUs in Industrial Sector

  • [Demand] While facing inventory reduction challenges from automotive customers, overall automotive and industrial businesses remain relatively stable, offsetting weakness in consumer and communications markets. The Chinese automotive market shows strong performance, with Japan and the Asia-Pacific region exhibiting positive sequential trends. Inventory reduction at Tier 1 suppliers in Europe and the Americas is nearing completion. Demand for general-purpose MCUs in industrial applications remains stable, while the IoT MCU market is showing signs of recovery. Key improvements stem from shipments aligning more closely with natural end-user demand and the near-completion of Tier 1 inventory depletion.
  • [News]The 16-bit S12 MagniV® mixed-signal MCU released on October 14 garnered market attention, meeting AEC-Q100 standards.

ADI: AD5412AREZ/AD5412AREZ-REEL7 currently trending

  • [Lead Times]Amplifiers and data converters: 12-20 weeks; Switching regulators: 10-14 weeks.
  • [Hot Items]AD5412AREZ/AD5412AREZ-REEL7 are low-cost, precision, fully integrated 12/16-bit digital-to-analog converters (DACs) with built-in programmable current sources and programmable voltage outputs, designed for industrial process control applications and primarily used in process control, actuator control, PLCs, and HART network connectivity (LFCSP package only), with limited market availability currently.
  • [Product]ADPD4100/ADPD4101 serve as sensor hubs for applications including heart rate monitoring, blood pressure estimation, SpO₂, and hydration monitoring, ultimately used in wearable health and fitness monitors.

MICROCHIP: Overall lead times shortened

  • [Demand]Industrial and consumer sectors show weak demand due to inventory pressures; automotive electronics maintain stable demand for automotive-grade RISC-V MCUs (e.g., PIC64GX).
  • [Lead Times]Overall lead times have further shortened: general-purpose 8-bit/16-bit MCUs can be scheduled for shipment in as little as 4 weeks; interface chips (Ethernet, USB, etc.) require 6–12 weeks; FPGAs and automotive-grade devices still need 8–32 weeks. Automotive-grade RISC-V MCUs (e.g., PIC64GX) face extended delivery cycles due to supply chain fluctuations.

YAGEO: YC Series Process Change

  • [Pricing]Prices remain stable with no significant changes.
  • [Lead Time]Stable original manufacturer capacity ensures normal delivery schedules: 8 weeks for standard components; 14 weeks for specialty items like alloy resistors and thin-film resistors; 14 weeks for AC automotive-grade products.
  • [Information]
    • YC Series Process Change Notice: For YC series side-terminal resistors, the process has changed from silver plating to sputtering (Industry 4.0 upgrade: production line automation/digitization). Affected YAGEO series include: YC122, YC124, YC164, YC248, YC324, YC358, YC158.
    • Certification Note Removal Notice: AEC-Q200 certification notes will be removed from the datasheets of YC series and TC series array resistors. [Reason: The YC and TC series were initially developed for consumer and industrial applications, but are now also used in specific automotive applications. Customers considering using the YC or TC series for automotive applications should conduct their own validation and risk assessment processes. To ensure precise product positioning and avoid potential misunderstandings, the AEC-Q200 certification statement will be removed from the YC and TC series datasheets.

Infineon: Price Increases for Selected Models

  • [Pricing]Infineon's fiscal year ended in September, with special pricing for specific models expiring. The manufacturer will gradually implement new pricing in October, during which some models may experience price increases.
  • [Inventory]Industry inventory is slowly returning to normal levels. Currently, Infineon has seen a slight inventory buildup for some MCUs, with destocking rates slowing.
  • [News]Infineon recently announced the consolidation of two existing factories in Bangalore, India. The new campus will be fully completed and operational by fall 2026, dedicated to developing semiconductor solutions that advance decarbonization and digitalization.

DIODES: Limited supply for specific low-margin components

  • [Pricing]The manufacturer has confirmed that shipment batches are now available within a 3-year timeframe. Specific low-margin components will be supplied in limited quantities, potentially leading to price increases.
  • [Lead Times]For MOSFETs, diodes, transistors, and power supplies: - 2-3 weeks for items in stock at the original manufacturer - 15-20 weeks for back ordered items crystals (PERICOM series): 3-4 weeks for in-stock items; 16-20 weeks for back orders.
  • [New Products]Diodes introduces the PI7C9X762Q dual-channel UART network bridge for electric vehicles.

Introduces AL58818Q and AL58812Q series LED drivers for automotive lighting applications. Volume pricing for AL58818Q and AL58812Q is $0.85 and $0.80, respectively, with a minimum order quantity of 5,000 pieces.

ON: Strong demand in the electric vehicle sector

  • [Demand]Demand in traditional consumer electronics and industrial sectors is undergoing cyclical adjustments. Its core business, silicon carbide (SiC), has secured long-term supply agreements with major automakers and Tier 1 suppliers in the electric vehicle sector, ensuring robust and predictable demand for the coming years.
  • [Lead Times]Rectifier diodes: 10-12 weeks; Power modules: 16-20 weeks; image sensors: 20-24 weeks; Regulators: 12-16 weeks; Logic devices: 10-14 weeks.

EDAC: Gold-plated series products to increase in price in November

  • [Pricing]Distributor feedback indicates EDAC's manufacturer anticipates a price increase in November. The adjustment will apply to EDAC's gold-plated series, with both catalog prices and discounts correspondingly adjusted upward. Affected series include the 516 series, 680M series, 684M series, etc.

SAMTEC: Raw Material Price Increases Expected to Raise Select Models by 3%-5%

  • [Pricing]Due to sustained increases in gold and palladium prices throughout October, manufacturers like Samtec, C&K, and NKK—whose high-end products (e.g., medical sealed switches, high-speed connectors) derive 30%-40% of costs from these metals—may implement 3%-5% price adjustments.
  • [New Products]On October 9th, the official website announced the U.FL/MHF®1 cable connector series, introducing new products RF047-A-11RP9 and RF047-A-11SP9. Currently unavailable across all channels. For inquiries, contact the connector department directly for pricing via authorized distributor channels.

 Key Advantages: ① Extended ferrules provide metalized stress relief, ② Enhanced durability protects solder joints, ③ Ideal for extremely dense or constrained applications

Shows two different types of RF (Radio Frequency) connectors and related components

NICOMATIC: Popular Double-Row Connectors with Prefixes 22- and 32-

  • [Hot Items]Popular and standard series include dual-row connectors with prefixes 22- and 32-, such as 221V06F26, 221V34F26, 222S34M16, 321V018F46, etc.

GigaDevice: Upstream chip shortages drive sustained price hikes for domestic storage

  • [Pricing]All domestic memory brands, including GigaDevice, have raised prices by 10-60% since August, with continued upward pressure. Some quotes are updated hourly.
    • Taiwanese Storage: Winbond, Macronix, Nanya.
    • Domestic Storage: GigaDevice, FORESEE, Lanchi, Jingcun, Changxin Memory.
  • [Demand]Upstream wafer shortages have prompted end-users to stockpile in advance, creating a supply-demand imbalance.
  • [Insights]For domestic module manufacturers' primary dram source, Micron supplied wafers worth 3.7 billion yuan last year and is currently undergoing an IPO. The three major original chip manufacturers have halted production for capacity upgrades, shifting inventory from LPDDR4 to LPDDR5.

 

Chip Vision (Industry Insights)

Severe memory shortages expected to drive further price increases in Q4 2025 and 2026

According to Taiwan's Commercial Times, both DRAM and NAND flash markets face shortages more severe than previous forecasts, with industry prices expected to rise further in Q4 2025 and 2026.

On one hand, major global cloud providers have substantially increased their 2026 orders, leaving the three major memory manufacturers—SK Hynix, Micron, and Samsung—with insufficient inventory. Future production capacity may struggle to meet customer demand. On the other hand, traditional HDD manufacturers have successively reduced production, potentially causing at least six months of supply shortages. This shift may force some orders to transition to SSDs, further straining the NAND supply chain.

Debon Securities notes that this storage industry upturn differs from the 2016-2019 and 2020-2023 cycles. While the earlier cycles were primarily driven by consumer demand, the current surge stems largely from large tech companies' infrastructure investments in computing power for the AI era, suggesting stronger sustainability.

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