HLK-LD6002B
Manufacturer: Hi-Link
Part Number: HLK-LD6002B
| Attribute | Value |
| cate_name | Smart Modules |
| rohs | |
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| mounting | |
| application_level | |
| lifecycle | |
| spm | |
| operating_temperature | |
| length_width_height | |
| agreement | - |
| antenna_form | - |
| chip_platform | - |
| data_rate | - |
| interface | - |
| working_voltage | - |
Overview:
The Hi-Link HLK-LD6002B is a cutting-edge IoT development board designed to provide developers with a versatile platform for creating smart home and industrial IoT applications. It combines powerful hardware with a user-friendly interface, making it an ideal choice for both beginners and experienced developers.
Features:
1. High-Performance Processor: Equipped with a robust processor for efficient data handling and processing.
2. Connectivity Options: Supports Wi-Fi, Bluetooth, and Zigbee for seamless integration with various smart devices.
3. Expandability: Multiple GPIOs and expansion ports allow for easy addition of sensors and modules.
4. Power Management: Advanced power management features ensure efficient energy use and prolong battery life.
5. Security: Incorporates secure boot and encryption protocols to protect data integrity.
Development Support:
- Software Tools: Comprehensive SDK and API documentation to facilitate easy development.
- Community Support: Active online forums and technical support for developers to share knowledge and troubleshoot issues.
- Tutorial Resources: Step-by-step tutorials and example projects to help developers get started quickly.
Application Fields:
- Smart Home Automation: Control lighting, heating, and security systems.
- Industrial : Monitor equipment status and environmental conditions in industrial settings.
- Healthcare Devices: Develop wearable devices for health and data collection.
- Agricultural Technology: Implement IoT solutions for precision farming and crop management.
Parameter Introduction:
- Processor: ARM Cortex-M4, 120MHz.
- Memory: 512KB Flash, 128KB SRAM.
- Connectivity: Wi-Fi 802.11 b/g/n, Bluetooth 5.0, Zigbee 3.0.
- Power Supply: 5V DC, USB Type-C.
- Operating Temperature: -20°C to 70°C.
- Dimensions: 100mm x 70mm.
FAQ:
1. Q: Can the HLK-LD6002B be used for outdoor applications?
A: While it is designed for indoor use, it can be adapted for outdoor applications with proper enclosure and protection.
2. Q: What kind of sensors can I connect to the HLK-LD6002B?
A: You can connect a wide range of sensors including temperature, humidity, pressure, and motion sensors through the GPIOs.
3. Q: Is there support for cloud integration?
A: Yes, the board supports integration with various cloud platforms for data storage and remote management.
4. Q: How can I get started with developing on the HLK-LD6002B?
A: Start by downloading the SDK, reading the documentation, and following the provided tutorials to understand the capabilities and start your project.
5. Q: Is there a warranty or return policy for the HLK-LD6002B?
A: Yes, the HLK-LD6002B comes with a standard warranty and return policy as per the manufacturer's terms and conditions.
This introduction provides a comprehensive overview of the Hi-Link HLK-LD6002B, highlighting its capabilities, development support, and potential applications, making it an excellent choice for IoT projects.
Please refer to the product rule book for details.
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