HLK-LD6002
Manufacturer: Hi-Link
Part Number: HLK-LD6002
| Attribute | Value |
| cate_name | Smart Modules |
| rohs | |
| reference_package | |
| mounting | |
| application_level | |
| lifecycle | |
| spm | |
| operating_temperature | |
| length_width_height | |
| agreement | - |
| antenna_form | - |
| chip_platform | - |
| data_rate | - |
| interface | - |
| working_voltage | - |
Overview:
The Hi-Link HLK-LD6002 is a versatile and powerful development board designed for IoT applications. It features a high-performance microcontroller, rich peripherals, and a comprehensive software ecosystem, making it an ideal platform for developers to quickly prototype and develop IoT devices.
Features:
1. High-performance microcontroller with ARM Cortex-M7 core, running at up to 480 MHz.
2. Integrated Wi-Fi and Bluetooth connectivity for seamless IoT device communication.
3. Rich peripherals, including UART, SPI, I2C, ADC, and PWM, to support various sensor and actuator integrations.
4. Onboard real-time clock, watchdog timer, and power management features for reliable operation.
5. Comprehensive software development tools and libraries for easy programming and debugging.
Development Support:
1. Extensive documentation, including user manuals, API references, and sample code.
2. Active community support for troubleshooting and sharing development experiences.
3. Regular software updates and bug fixes to ensure the platform remains up-to- and reliable.
Application Fields:
1. Smart home automation, such as lighting control, temperature , and security systems.
2. Industrial IoT applications, including sensor data collection, equipment , and predictive maintenance.
3. Healthcare , such as patient vital signs tracking and remote health consultations.
4. Environmental , including air quality, temperature, and humidity sensing.
Parameters:
- Microcontroller: ARM Cortex-M7, 480 MHz
- Memory: 512 KB Flash, 192 KB SRAM
- Connectivity: Wi-Fi, Bluetooth
- Power Supply: 3.3V DC
- Operating Temperature: -40°C to 85°C
- Dimensions: 68mm x 55mm
FAQs:
1. Q: Is the Hi-Link HLK-LD6002 suitable for beginners?
A: Yes, the comprehensive development support and easy-to-use software tools make it suitable for both beginners and experienced developers.
2. Q: Can I use the Hi-Link HLK-LD6002 for outdoor applications?
A: While the board itself is not weatherproof, you can design an enclosure to protect it from the elements for outdoor applications.
3. Q: Does the Hi-Link HLK-LD6002 support other wireless communication protocols besides Wi-Fi and Bluetooth?
A: The board primarily supports Wi-Fi and Bluetooth, but you can add other communication modules, such as LoRa or Zigbee, through the available expansion interfaces.
4. Q: Can I use the Hi-Link HLK-LD6002 for commercial products?
A: Yes, the board is designed for prototyping and developing IoT devices, and it can be used as a foundation for commercial products with proper licensing and compliance.
5. Q: Is there any support for cloud integration?
A: Yes, the Hi-Link HLK-LD6002 supports various cloud platforms, such as AWS IoT, Azure IoT, and Google Cloud IoT, allowing you to easily connect your IoT devices to the cloud for data storage, processing, and analysis.
Please refer to the product rule book for details.
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