TFM-107-01-L-D-RE1-WT
Manufacturer: samtec
Part Number: TFM-107-01-L-D-RE1-WT
Attribute | Value |
cate_name | Male Pin Headers |
Datasheet | TFM-107-01-L-D-RE1-WT samtec |
rohs | Compliance |
reference_package | |
mounting | Through hole mounting |
application_level | Industrial |
lifecycle | On sale |
spm | Tube |
operating_temperature | -55℃~125℃ |
length_width_height | 15.57mm(length)*8mm(height) |
color | black |
contact_plating_mating | gold |
contact_plating_thickness_mating | 380nm |
current_rating | 2.9A |
ip_rating | - |
number_of_positions | 14pin |
number_of_rows | 2 |
pitch_mating | 1.27mm |
row_spacing | 1.27mm |
type | Elevated,Header,Push-Pull |
Overview:
The Samtec TFM-107-01-L-D-RE1-WT is a high-performance mezzanine connector system designed to meet the demands of high-speed digital and power applications. This connector system is part of Samtec's Flyover Mezzanine (TFM) series, offering a reliable and efficient solution for interconnecting high-density PCBs in various electronic systems.
Features:
1. High-Density Configuration: The TFM-107-01-L-D-RE1-WT provides a compact and high-density interconnect solution, ideal for space-constrained applications.
2. Signal Integrity: With its flyover design, the connector ensures minimal signal degradation, maintaining high signal integrity across the board.
3. Versatile Power Distribution: The system supports both high-speed signal and power distribution, making it suitable for a wide range of applications.
4. Robust Construction: Built with a durable material, the connector can withstand the rigors of frequent mating and unmating cycles.
5. Customizable Options: The TFM-107-01-L-D-RE1-WT offers various customization options to fit specific design requirements.
Development Support:
Samtec provides comprehensive development support, including:
- Technical documentation
- 3D models for design integration
- Simulation tools for signal integrity analysis
- Application engineering support to assist with design challenges
Application Fields:
The TFM-107-01-L-D-RE1-WT is suitable for a variety of applications where high-speed data transmission and power delivery are required, such as:
- Telecommunications equipment
- High-performance computing
- and electronics
- Medical imaging devices
- Industrial automation systems
Parameter Introduction:
- Contact Density: Up to 107 contacts per linear inch
- Signal Speed: Designed for high-speed data transmission
- Power Delivery: Capable of handling high current loads
- Operating Temperature: -40°C to +85°C
- Mating Cycles: Designed for long life with thousands of mating cycles
Frequently Asked Questions (FAQs):
1. Q: What makes the TFM-107-01-L-D-RE1-WT different from other connectors?
A: The TFM-107-01-L-D-RE1-WT stands out due to its high-density configuration, flyover design for maintaining signal integrity, and its ability to handle both high-speed signals and power distribution.
2. Q: How does the TFM-107-01-L-D-RE1-WT ensure signal integrity?
A: The flyover design of the TFM-107-01-L-D-RE1-WT minimizes crosstalk and signal interference, ensuring high signal integrity even at high data rates.
3. Q: Can the TFM-107-01-L-D-RE1-WT be customized?
A: Yes, Samtec offers various customization options for the TFM-107-01-L-D-RE1-WT to meet specific design requirements, including different contact arrangements and materials.
4. Q: What kind of development support does Samtec provide for the TFM-107-01-L-D-RE1-WT?
A: Samtec provides a range of development support, including technical documentation, 3D models, simulation tools, and application engineering support to assist with design and integration.
5. Q: What are the environmental considerations for the TFM-107-01-L-D-RE1-WT?
A: The TFM-107-01-L-D-RE1-WT is designed to operate in a wide temperature range of -40°C to +85°C, making it suitable for various environmental conditions.
By understanding the overview, features, development support, application fields, and parameters of the Samtec TFM-107-01-L-D-RE1-WT, designers can make informed decisions when selecting a mezzanine connector system for their high-speed and power applications.
Please refer to the product rule book for details.
Samtec's product portfolio is extensive and diverse, encompassing everything from simple connectors to complex electronic systems. Their offerings include high-speed board-to-board, high-speed cables, backplane, microelectronic packaging, optics, and precision RF solutions, as well as custom solutions tailored to meet specific customer needs. Samtec's focus on high-speed communication technology has positioned it as a leader in the development of next-generation products, supporting the increasing demands for faster and more reliable data transmission.
Innovation is at the core of Samtec's operations. The company invests heavily in research and development, maintaining state-of-the-art facilities that foster the creation of new technologies and products. Samtec's engineering teams are equipped with advanced tools and have a keen focus on solving the industry's most challenging problems. This dedication to innovation is complemented by Samtec's unique business model, which emphasizes flexibility and fast response times, enabling the company to meet tight deadlines and rapidly changing market demands.
Quality and customer service are paramount at Samtec. The company is committed to providing its customers with products that meet the highest standards of quality and performance. Samtec's manufacturing processes are certified to international standards, including ISO 9001 and ISO 14001, ensuring that all products are produced with the utmost attention to quality and environmental management. Additionally, Samtec places a strong emphasis on customer support, offering technical assistance, product customization, and logistical support to ensure customer satisfaction.
Samtec's global presence includes manufacturing facilities, sales offices, and design centers across North America, Europe, Asia, and other regions, enabling it to serve customers around the world effectively. The company's global distribution network ensures that its products are available wherever they are needed, and its international team is well-versed in the regulatory and technical requirements of various markets.
As a responsible corporate citizen, Samtec is committed to sustainability and social responsibility. The company actively participates in community outreach programs and supports various educational initiatives to promote science, technology, engineering, and mathematics (STEM) education. Samtec's commitment to environmental sustainability is evident in its efforts to minimize its ecological footprint through waste reduction, energy conservation, and the use of environmentally friendly materials and processes.
In conclusion, Samtec stands out in the electronic interconnect industry for its commitment to innovation, quality, and customer service. With a broad product range, a focus on high-speed technology, and a global footprint, Samtec continues to lead the way in developing and delivering effective solutions to meet the evolving needs of its customers in the electronics industry.
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