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    XC3S50A-4TQG144C

    Manufacturer: XILINX

    Part Number: XC3S50A-4TQG144C

    Description: 54Kbit 1584 176 1.14V 1.26V TQFP SMD mount 20mm*20mm*1.6mm
    Quantity: 900
    In Stock
    Number:
    - +
    * $5.13 (Unit Price)
    MOQ 300 Mult 1 SPQ 300 DC 22+
    Ext. Price: $1539.00
    Quantity Unit Price
    300 600 900
    $5.13 $5.04 $4.95
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    Specifications
    Attribute Value
    cate_name Field Programmable Gate Arrays (FPGA)
    Datasheet XC3S50A-4TQG144C XILINX
    rohs Compliance
    reference_package TQFP
    mounting SMD mount
    application_level Commercial
    lifecycle On sale
    spm tray
    min_operating_temperature 0℃(TJ)
    max_operating_temperature 85℃(TJ)
    length_width_height 20mm*20mm*1.6mm
    max_operating_supply_voltage 1.26V
    min_operating_supply_voltage 1.14V
    number_of_labclb 176
    number_of_logic_blocks 1584
    total_ram_bits 54Kbit
    Description
    Xilinx XC3S50A-4TQG144C: An Overview

    The Xilinx XC3S50A-4TQG144C is a high-performance Field Programmable Gate Array (FPGA) belonging to the Spartan-3 series. This device is designed to offer a balance between performance, power, and cost, making it suitable for a wide range of applications.

    Features:
    1. Advanced 90nm technology: The XC3S50A-4TQG144C is built using Xilinx's advanced 90nm process technology, providing high-speed performance and low power consumption.
    2. High-density logic: With up to 50,000 logic cells, this FPGA offers a high-density logic capacity for complex designs.
    3. Enhanced I/O capabilities: The device features 144 I/O pins, providing flexible connectivity options for various peripherals.
    4. On-chip memory: The XC3S50A-4TQG144C includes 288 Kbits of block RAM, allowing for efficient data storage and processing.
    5. High-speed transceivers: The FPGA supports high-speed transceivers for data rates up to 3.125 Gbps, enabling high-speed communication in various applications.

    Development Support:
    1. Xilinx ISE Design Suite: The XC3S50A-4TQG144C is supported by the Xilinx ISE Design Suite, a comprehensive development environment for designing, simulating, and implementing FPGA designs.
    2. Core Generator: Xilinx Core Generator provides a library of pre-designed intellectual property (IP) cores that can be easily integrated into the FPGA design.
    3. EDK: The Embedded Development Kit (EDK) allows developers to create embedded systems using the XC3S50A-4TQG144C, with support for microprocessors, memory controllers, and other peripherals.

    Application Areas:
    1. Communications: The XC3S50A-4TQG144C is suitable for high-speed communication applications, such as serial transceivers, Ethernet, and USB.
    2. Industrial control: The FPGA can be used in industrial control systems for motor control, sensor interfacing, and data acquisition.
    3. Automotive: The device can be used in automotive applications, such as infotainment systems, driver assistance systems, and engine control.
    4. Consumer electronics: The XC3S50A-4TQG144C can be used in consumer electronics for video processing, audio processing, and display control.

    Parameter Introduction:
    1. Package: TQG144
    2. Speed grade: -4
    3. Voltage range: 1.2V to 2.5V
    4. Operating temperature range: -40°C to 85°C
    5. Logic cells: Up to 50,000
    6. Block RAM: 288 Kbits
    7. I/O pins: 144
    8. High-speed transceiver data rate: Up to 3.125 Gbps

    FAQs:
    1. Q: What is the main advantage of using the Xilinx XC3S50A-4TQG144C FPGA?
    A: The main advantage is the balance between performance, power, and cost, making it suitable for a wide range of applications.

    2. Q: Can the XC3S50A-4TQG144C be used in high-speed communication applications?
    A: Yes, it supports high-speed transceivers for data rates up to 3.125 Gbps, making it suitable for high-speed communication applications.

    3. Q: What development tools are available for the XC3S50A-4TQG144C?
    A: The FPGA is supported by the Xilinx ISE Design Suite, Core Generator, and Embedded Development Kit (EDK).

    4. Q: What is the maximum operating temperature for the XC3S50A-4TQG144C?
    A: The maximum operating temperature is 85°C.

    5. Q: How many I/O pins does the XC3S50A-4TQG144C have?
    A: The device has 144 I/O pins.
    Please refer to the product rule book for details.
    Manufacturer Introduction
    Xilinx, Inc., now part of Advanced Micro Devices (AMD) following its acquisition in 2021, is a prominent player in the semiconductor industry, renowned for its innovation in adaptive computing technologies. Founded in 1984 by Ross Freeman, Bernard Vonderschmitt, and James V Barnett II in San Jose, California, Xilinx revolutionized the technology landscape by inventing the field-programmable gate array (FPGA). This invention has enabled a wide range of applications, from telecommunications to automotive systems, and has significantly impacted the development of hardware and software integration.

    Xilinx has consistently been at the forefront of technology, developing products that enhance the performance and flexibility of a myriad of electronic systems. The company's product line includes FPGAs, complex programmable logic devices (CPLDs), and system on chip (SoC) solutions, along with a robust suite of software tools for design and analysis. These products are fundamental in the creation of digital circuits that can be programmed and reprogrammed to perform specific functions and adapt to new requirements without the need to redesign the hardware.

    One of Xilinx's key innovations is the Adaptive Compute Acceleration Platform (ACAP), a highly integrated multi-core heterogeneous compute platform that goes beyond traditional FPGA technology. ACAPs are designed to provide significant performance acceleration for a variety of applications, including machine learning, video processing, and data analytics. This technology exemplifies Xilinx's commitment to pushing the boundaries of what can be achieved with programmable logic technologies.

    Xilinx's technology is crucial in numerous industries, including data centers, wireless communications, industrial, medical, , and defense sectors. In data centers, Xilinx's solutions help in accelerating workloads such as artificial intelligence and database management, thereby enhancing efficiency and reducing operational costs. In the wireless sector, the company's technology facilitates the deployment of next-generation networks, including 5G, by offering flexible and scalable solutions.

    The company's approach to market-driven innovation has also led to the development of the Vivado Design Suite, an advanced and highly integrated design environment that provides system-to-IC level tools designed to increase productivity and accelerate time-to-market. Vivado uses a shared scalable data model and a common debug environment, which supports the company's devices from low-end to ultra-high-end families.

    Xilinx also places a strong emphasis on sustainability and corporate responsibility. The company's initiatives focus on reducing environmental impact through energy-efficient products and solutions that contribute to the creation of sustainable technology ecosystems. Xilinx's global presence includes not only its headquarters in San Jose but also numerous offices worldwide, with a significant focus on research and development to maintain its competitive edge in the semiconductor industry.

    As part of AMD, Xilinx continues to leverage its expertise in adaptive computing, contributing to AMD's broader strategy of high-performance and adaptive computing solutions. This synergy enhances the combined company's ability to drive innovation in the computing and graphics markets, furthering advancements in areas such as high-performance computing, edge computing, and more.

    In conclusion, Xilinx's legacy and ongoing contributions to the semiconductor industry underline its status as a leader in adaptive and programmable computing solutions. With a history marked by innovation and a future aimed at driving technological advancements, Xilinx remains a key player in shaping the digital future.
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