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    XC3S200A-4FTG256I

    Manufacturer: XILINX

    Part Number: XC3S200A-4FTG256I

    Description: 288Kbit 4032 448 1.14V 1.26V FTBGA-256 SMD mount 17mm*17mm*1.4mm
    Quantity: 2000
    In Stock
    Number:
    - +
    * $8.436 (Unit Price)
    MOQ 420 Mult 1 SPQ 420 DC 22+
    Ext. Price: $3543.12
    Quantity Unit Price
    420 840 1260
    $8.436 $8.288 $8.14
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    Specifications
    Attribute Value
    cate_name Field Programmable Gate Arrays (FPGA)
    Datasheet XC3S200A-4FTG256I XILINX
    rohs Compliance
    reference_package FTBGA-256
    mounting SMD mount
    application_level Industrial
    lifecycle On sale
    spm tray
    min_operating_temperature -40℃(TJ)
    max_operating_temperature 100℃(TJ)
    length_width_height 17mm*17mm*1.4mm
    max_operating_supply_voltage 1.26V
    min_operating_supply_voltage 1.14V
    number_of_labclb 448
    number_of_logic_blocks 4032
    total_ram_bits 288Kbit
    Description
    Xilinx XC3S200A-4FTG256I: An Overview

    The Xilinx XC3S200A-4FTG256I is a high-performance Field Programmable Gate Array (FPGA) designed for a wide range of applications, from digital signal processing to complex system integration. This device is part of the Spartan-3 family, known for its low power consumption, high integration, and versatile functionality.

    Features:
    1. Performance: The XC3S200A-4FTG256I offers high-speed performance with a clock frequency of up to 200 MHz, making it suitable for demanding applications.
    2. Logic Cells: It contains approximately 200,000 logic cells, providing ample resources for complex designs.
    3. I/O Pins: With 256 I/O pins, this FPGA can interface with a wide variety of external components.
    4. Memory: The device includes 288 Kbits of block RAM, which can be used for data storage and processing.
    5. DSP Slices: It has 40 DSP slices, which are optimized for digital signal processing tasks.
    6. Power Management: Advanced power management features help reduce power consumption, making the device suitable for portable and battery-powered applications.

    Development Support:
    - Xilinx provides a comprehensive development environment called Vivado, which includes a suite of tools for designing, simulating, and programming the XC3S200A-4FTG256I.
    - IP cores and libraries are available to accelerate development and reduce time to market.
    - Comprehensive documentation and community forums provide additional support.

    Application Areas:
    - Communications: Ideal for telecom infrastructure, networking, and wireless applications.
    - Industrial Control: Used in motor control, sensor interfacing, and machine vision systems.
    - Automotive: Suitable for in-vehicle infotainment systems, driver assistance systems, and engine control.
    - Consumer Electronics: Employed in high-definition video processing and audio systems.

    Parameter Introduction:
    - Process Technology: 90 nm
    - Package Type: Flip-Chip Ball Grid Array (FTG256)
    - Operating Temperature: Commercial (0°C to 70°C) and Industrial (-40°C to 85°C)
    - Power Supply Voltage: 1.2V to 2.5V

    FAQs:
    1. Q: What is the XC3S200A-4FTG256I FPGA used for?
    A: It is used for a variety of applications including digital signal processing, system integration, communications, industrial control, automotive, and consumer electronics.

    2. Q: How many I/O pins does the XC3S200A-4FTG256I have?
    A: It has 256 I/O pins.

    3. Q: What kind of memory does the XC3S200A-4FTG256I include?
    A: It includes 288 Kbits of block RAM.

    4. Q: Is there development support available for the XC3S200A-4FTG256I?
    A: Yes, Xilinx provides a comprehensive development environment, Vivado, along with IP cores, libraries, documentation, and community support.

    5. Q: What is the maximum clock frequency of the XC3S200A-4FTG256I?
    A: The maximum clock frequency is up to 200 MHz.

    6. Q: Is the XC3S200A-4FTG256I suitable for high-temperature environments?
    A: It is available in both commercial and industrial temperature ranges, making it suitable for high-temperature environments if required.

    The Xilinx XC3S200A-4FTG256I FPGA is a versatile and powerful solution for engineers looking to implement complex digital designs with high-speed performance and low power consumption.
    Please refer to the product rule book for details.
    Manufacturer Introduction
    Xilinx, Inc., now part of Advanced Micro Devices (AMD) following its acquisition in 2021, is a prominent player in the semiconductor industry, renowned for its innovation in adaptive computing technologies. Founded in 1984 by Ross Freeman, Bernard Vonderschmitt, and James V Barnett II in San Jose, California, Xilinx revolutionized the technology landscape by inventing the field-programmable gate array (FPGA). This invention has enabled a wide range of applications, from telecommunications to automotive systems, and has significantly impacted the development of hardware and software integration.

    Xilinx has consistently been at the forefront of technology, developing products that enhance the performance and flexibility of a myriad of electronic systems. The company's product line includes FPGAs, complex programmable logic devices (CPLDs), and system on chip (SoC) solutions, along with a robust suite of software tools for design and analysis. These products are fundamental in the creation of digital circuits that can be programmed and reprogrammed to perform specific functions and adapt to new requirements without the need to redesign the hardware.

    One of Xilinx's key innovations is the Adaptive Compute Acceleration Platform (ACAP), a highly integrated multi-core heterogeneous compute platform that goes beyond traditional FPGA technology. ACAPs are designed to provide significant performance acceleration for a variety of applications, including machine learning, video processing, and data analytics. This technology exemplifies Xilinx's commitment to pushing the boundaries of what can be achieved with programmable logic technologies.

    Xilinx's technology is crucial in numerous industries, including data centers, wireless communications, industrial, medical, , and defense sectors. In data centers, Xilinx's solutions help in accelerating workloads such as artificial intelligence and database management, thereby enhancing efficiency and reducing operational costs. In the wireless sector, the company's technology facilitates the deployment of next-generation networks, including 5G, by offering flexible and scalable solutions.

    The company's approach to market-driven innovation has also led to the development of the Vivado Design Suite, an advanced and highly integrated design environment that provides system-to-IC level tools designed to increase productivity and accelerate time-to-market. Vivado uses a shared scalable data model and a common debug environment, which supports the company's devices from low-end to ultra-high-end families.

    Xilinx also places a strong emphasis on sustainability and corporate responsibility. The company's initiatives focus on reducing environmental impact through energy-efficient products and solutions that contribute to the creation of sustainable technology ecosystems. Xilinx's global presence includes not only its headquarters in San Jose but also numerous offices worldwide, with a significant focus on research and development to maintain its competitive edge in the semiconductor industry.

    As part of AMD, Xilinx continues to leverage its expertise in adaptive computing, contributing to AMD's broader strategy of high-performance and adaptive computing solutions. This synergy enhances the combined company's ability to drive innovation in the computing and graphics markets, furthering advancements in areas such as high-performance computing, edge computing, and more.

    In conclusion, Xilinx's legacy and ongoing contributions to the semiconductor industry underline its status as a leader in adaptive and programmable computing solutions. With a history marked by innovation and a future aimed at driving technological advancements, Xilinx remains a key player in shaping the digital future.
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