XC3S200A-4FTG256C
Manufacturer: XILINX
Part Number: XC3S200A-4FTG256C
| Attribute | Value |
| cate_name | Field Programmable Gate Arrays (FPGA) |
| Datasheet | XC3S200A-4FTG256C XILINX |
| rohs | Compliance |
| reference_package | FBGA-256 |
| mounting | SMD mount |
| application_level | Commercial |
| lifecycle | On sale |
| spm | tray |
| min_operating_temperature | 0℃(TJ) |
| max_operating_temperature | 85℃(TJ) |
| length_width_height | 17mm*17mm*1.4mm |
| max_operating_supply_voltage | 1.26V |
| min_operating_supply_voltage | 1.14V |
| number_of_labclb | 448 |
| number_of_logic_blocks | 4032 |
| total_ram_bits | 288Kbit |
The Xilinx XC3S200A-4FTG256C is a high-performance Field Programmable Gate Array (FPGA) device from the Spartan-3 family, designed to meet the needs of various applications in the electronics industry. This device is known for its versatility, reliability, and cost-effectiveness, making it a popular choice for engineers and designers.
Features:
1. Advanced 90nm process technology for high-speed performance and low power consumption.
2. Up to 200,000 logic cells and 256Kb of block RAM for complex designs.
3. Dedicated digital clock managers for high-speed clocking and synchronization.
4. High-speed I/Os for interfacing with various peripherals and external devices.
5. Configurable logic blocks for efficient resource utilization.
6. On-chip Block RAM for data storage and processing.
7. In-system programmability for easy updates and reconfiguration.
Development Support:
Xilinx provides comprehensive development tools and resources for the XC3S200A-4FTG256C, including:
1. Xilinx ISE Design Suite for schematic entry, simulation, and synthesis.
2. Core Generator for instantiating and configuring intellectual property (IP) cores.
3. ChipScope Pro for on-chip debug and trace.
4. PlanAhead for implementation and optimization.
5. Comprehensive documentation and technical support.
Application Areas:
The XC3S200A-4FTG256C is suitable for a wide range of applications, including:
1. Digital signal processing (DSP)
2. Video processing and image recognition
3. Telecommunications and networking
4. Industrial control and automation
5. Consumer electronics and multimedia devices
6. and applications
Parameter Introduction:
1. Device Family: Spartan-3
2. Package: FTG256 (Fine-pitch Ball Grid Array)
3. Speed Grade: -4 (0.8V operation)
4. I/O Standards: LVCMOS33, LVTTL, etc.
5. Operating Temperature Range: Commercial (0°C to 70°C) and Industrial (-40°C to 85°C)
6. Power Supply Voltage: 1.2V to 2.5V
Frequently Asked Questions (FAQs):
Q1: What is the maximum frequency of operation for the XC3S200A-4FTG256C?
A1: The maximum frequency depends on the specific design and implementation, but the device is capable of operating at high speeds due to its advanced 90nm process technology.
Q2: Can the XC3S200A-4FTG256C be used in high-reliability applications?
A1: Yes, the device is suitable for high-reliability applications, such as and , due to its robust design and comprehensive development support.
Q3: Is there any support for high-speed serial communication in the XC3S200A-4FTG256C?
A1: Yes, the device offers high-speed I/Os that can be configured for various serial communication protocols, such as UART, SPI, and I2C.
Q4: Can the XC3S200A-4FTG256C be reprogrammed after deployment?
A1: Yes, the device supports in-system programmability, allowing for easy updates and reconfiguration even after deployment.
Q5: What is the typical power consumption of the XC3S200A-4FTG256C?
A1: The power consumption depends on the specific design and implementation, but the device is designed for low power operation due to its advanced 90nm process technology.
Please refer to the product rule book for details.
Xilinx has consistently been at the forefront of technology, developing products that enhance the performance and flexibility of a myriad of electronic systems. The company's product line includes FPGAs, complex programmable logic devices (CPLDs), and system on chip (SoC) solutions, along with a robust suite of software tools for design and analysis. These products are fundamental in the creation of digital circuits that can be programmed and reprogrammed to perform specific functions and adapt to new requirements without the need to redesign the hardware.
One of Xilinx's key innovations is the Adaptive Compute Acceleration Platform (ACAP), a highly integrated multi-core heterogeneous compute platform that goes beyond traditional FPGA technology. ACAPs are designed to provide significant performance acceleration for a variety of applications, including machine learning, video processing, and data analytics. This technology exemplifies Xilinx's commitment to pushing the boundaries of what can be achieved with programmable logic technologies.
Xilinx's technology is crucial in numerous industries, including data centers, wireless communications, industrial, medical, , and defense sectors. In data centers, Xilinx's solutions help in accelerating workloads such as artificial intelligence and database management, thereby enhancing efficiency and reducing operational costs. In the wireless sector, the company's technology facilitates the deployment of next-generation networks, including 5G, by offering flexible and scalable solutions.
The company's approach to market-driven innovation has also led to the development of the Vivado Design Suite, an advanced and highly integrated design environment that provides system-to-IC level tools designed to increase productivity and accelerate time-to-market. Vivado uses a shared scalable data model and a common debug environment, which supports the company's devices from low-end to ultra-high-end families.
Xilinx also places a strong emphasis on sustainability and corporate responsibility. The company's initiatives focus on reducing environmental impact through energy-efficient products and solutions that contribute to the creation of sustainable technology ecosystems. Xilinx's global presence includes not only its headquarters in San Jose but also numerous offices worldwide, with a significant focus on research and development to maintain its competitive edge in the semiconductor industry.
As part of AMD, Xilinx continues to leverage its expertise in adaptive computing, contributing to AMD's broader strategy of high-performance and adaptive computing solutions. This synergy enhances the combined company's ability to drive innovation in the computing and graphics markets, furthering advancements in areas such as high-performance computing, edge computing, and more.
In conclusion, Xilinx's legacy and ongoing contributions to the semiconductor industry underline its status as a leader in adaptive and programmable computing solutions. With a history marked by innovation and a future aimed at driving technological advancements, Xilinx remains a key player in shaping the digital future.
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