HLK-B60
Manufacturer: Hi-Link
Part Number: HLK-B60
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| Attribute | Value |
| cate_name | Bluetooth Modules |
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| application_level | |
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| spm | |
| operating_temperature | |
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| antenna_form | - |
| chip_platform | - |
| consumption | - |
| emission_current | - |
| interface | - |
| receiving_current | - |
| sensitivity | - |
| support_agreement | - |
| transmitting_power | - |
| working_voltage | - |
Overview:
The Hi-Link HLK-B60 is a versatile and powerful development board designed for IoT applications. It combines the latest technology with user-friendly features, making it an ideal choice for developers and engineers looking to create innovative IoT solutions.
Features:
1. Powerful Processor: The HLK-B60 is equipped with a high-performance processor, ensuring fast and efficient operation.
2. Rich Peripherals: The board comes with a wide range of peripherals, including GPIOs, UART, SPI, I2C, and more, providing flexibility for various applications.
3. Wi-Fi and Bluetooth Connectivity: The HLK-B60 supports both Wi-Fi and Bluetooth, enabling seamless communication with other devices and the internet.
4. Easy-to-Use Interface: The board features an easy-to-use interface, making it simple for developers to get started with their projects.
5. Extensive Documentation: The HLK-B60 comes with comprehensive documentation, including schematics, API references, and sample code, to help developers quickly get up to speed.
Development Support:
1. Software Development Kit (SDK): The HLK-B60 provides an SDK that includes libraries, tools, and examples to help developers create their applications.
2. Technical Support: Hi-Link offers technical support to assist developers with any issues they may encounter during the development process.
3. Community Forum: The HLK-B60 has an active community forum where developers can share ideas, ask questions, and collaborate on projects.
Application Fields:
The Hi-Link HLK-B60 is suitable for a wide range of IoT applications, including smart home devices, industrial automation, wearable devices, and more.
Parameters:
1. CPU: Dual-core Cortex-A7
2. Memory: 512MB DDR3
3. Storage: 4GB eMMC
4. Connectivity: Wi-Fi 802.11 b/g/n, Bluetooth 4.2
5. GPIOs: 15
6. UART: 2
7. SPI: 2
8. I2C: 2
9. Operating Voltage: 5V
10. Operating Temperature: -20°C to 70°C
FAQs:
1. Q: What is the Hi-Link HLK-B60?
A: The Hi-Link HLK-B60 is a development board designed for IoT applications, featuring a powerful processor, rich peripherals, and Wi-Fi and Bluetooth connectivity.
2. Q: What kind of applications can the HLK-B60 be used for?
A: The HLK-B60 can be used for a wide range of IoT applications, including smart home devices, industrial automation, wearable devices, and more.
3. Q: Does the HLK-B60 come with development support?
A: Yes, the HLK-B60 provides an SDK, technical support, and an active community forum to assist developers during the development process.
4. Q: What are the main parameters of the HLK-B60?
A: The main parameters of the HLK-B60 include a dual-core Cortex-A7 CPU, 512MB DDR3 memory, 4GB eMMC storage, Wi-Fi 802.11 b/g/n, Bluetooth 4.2, 15 GPIOs, 2 UARTs, 2 SPIs, 2 I2Cs, and an operating voltage of 5V.
Please refer to the product rule book for details.
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